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SPIE Proceedings [SPIE Micromachining and Microfabrication - Santa Clara, CA (Sunday 20 September 1998)] Micromachined Devices and Components IV - Wafer bonding with an adhesive coating
Klink, Gerhard, Hillerich, Bernhard, French, Patrick J., Chau, Kevin H.Volume:
3514
Year:
1998
Language:
english
DOI:
10.1117/12.323903
File:
PDF, 1.44 MB
english, 1998