Effects of wet treatment conditions and pattern densities...

Effects of wet treatment conditions and pattern densities on interfacial bonding characteristics of Cu–Cu direct bonds

Park, Jong-Myeong, Kim, Jae-Won, Park, Young-Bae
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Volume:
53
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.7567/JJAP.53.05HB07
Date:
May, 2014
File:
PDF, 667 KB
english, 2014
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