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Experimental Investigation of Material Removal Characteristics in Silicon Chemical Mechanical Polishing
Park, Boumyoung, Jeong, Sukhoon, Lee, Hyunseop, Kim, Hyoungjae, Jeong, Haedo, Dornfeld, David A.Volume:
48
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/jjap.48.116505
Date:
November, 2009
File:
PDF, 400 KB
english, 2009