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Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications || Diffusion Barriers for Ultra-Large-Scale Integrated Copper Metallization
Shacham-Diamand, Yosi, Osaka, Tetsuya, Datta, Madhav, Ohba, TakayukiVolume:
10.1007/97
Year:
2009
Language:
english
DOI:
10.1007/978-0-387-95868-2_7
File:
PDF, 1.30 MB
english, 2009