A novel method of hotspot temperature reduction for a 3D stacked CMOS IC chip device fabricated on an ultrathin substrate
Kato, Fumiki, Nakagawa, Hiroshi, Aoyagi, MasahiroVolume:
23
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/23/2/025020
Date:
February, 2013
File:
PDF, 1.24 MB
english, 2013