A novel method of hotspot temperature reduction for a 3D...

A novel method of hotspot temperature reduction for a 3D stacked CMOS IC chip device fabricated on an ultrathin substrate

Kato, Fumiki, Nakagawa, Hiroshi, Aoyagi, Masahiro
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Volume:
23
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/23/2/025020
Date:
February, 2013
File:
PDF, 1.24 MB
english, 2013
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