Development of New Evaluation Method for Adhesive Strength...

Development of New Evaluation Method for Adhesive Strength between Microsized Photoresist and Si Substrate of MEMS Devices

Ishiyama, Chiemi, Sone, Masato, Higo, Yakichi
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Volume:
345-346
Year:
2007
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.345-346.1185
File:
PDF, 1.40 MB
english, 2007
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