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Development of New Evaluation Method for Adhesive Strength between Microsized Photoresist and Si Substrate of MEMS Devices
Ishiyama, Chiemi, Sone, Masato, Higo, YakichiVolume:
345-346
Year:
2007
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.345-346.1185
File:
PDF, 1.40 MB
english, 2007