Impact of Thermomechanical Stresses on Bumpless Chip in...

Japanese Journal of Applied Physics 2013 / 05 Vol. 52; Iss. 5S3

Impact of Thermomechanical Stresses on Bumpless Chip in Stacked Wafer Structure

Mizushima, Yoriko, Kitada, Hideki, Uchibori, Chihiro J., Maeda, Nobuhide, Kodama, Shoichi, Kim, Youngsuk, Fujimoto, Koji, Yoshimi, Seiichi, Nakamura, Tomoji, Ohba, Takayuki
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Volume:
52
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.7567/JJAP.52.05FE01
Date:
May, 2013
File:
PDF, 429 KB
english, 2013
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