New Cu(TiIrN x ) Alloy Films for Solder Bump Flip-Chip Application
Lin, Chon-HsinVolume:
52
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.7567/JJAP.52.11NJ04
Date:
November, 2013
File:
PDF, 1.19 MB
english, 2013