New Cu(TiIrN x )...

New Cu(TiIrN x ) Alloy Films for Solder Bump Flip-Chip Application

Lin, Chon-Hsin
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Volume:
52
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.7567/JJAP.52.11NJ04
Date:
November, 2013
File:
PDF, 1.19 MB
english, 2013
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