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ECS Transactions [ECS China Semiconductor Technology International Conference 2010 (CSTIC 2010) - Shanghai, China (March 18 - March 19, 2010)] - Packaging of High-Temperature Power Semiconductor Modules
Ang, Simon S., Rowden, Brian L., Blada, Juan C., Mantooth, H. A.Year:
2010
Language:
english
DOI:
10.1149/1.3360729
File:
PDF, 138 KB
english, 2010