A finite element model of electromigration induced void...

Modelling and Simulation in Materials Science and Engineering 2007 / 12 Vol. 15; Iss. 8

A finite element model of electromigration induced void nucleation, growth and evolution in interconnects

Bower, Allan F, Shankar, Sadasivan
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
15
Language:
english
Journal:
Modelling and Simulation in Materials Science and Engineering
DOI:
10.1088/0965-0393/15/8/008
Date:
December, 2007
File:
PDF, 465 KB
english, 2007
Conversion to is in progress
Conversion to is failed