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Improvement of Interfacial Adhesion Strength and Thermal Stability of Cu/p-SiC:H/SiOC:H Film Stack by Plasma Treatment on the Surface of Cu Film
Liu, Bo, Yang, Jijun, Jiao, Guohua, Xu, KeweiVolume:
14
Language:
english
Journal:
Plasma Science and Technology
DOI:
10.1088/1009-0630/14/7/12
Date:
July, 2012
File:
PDF, 3.80 MB
english, 2012