![](/img/cover-not-exists.png)
Measurement of the mechanical stability of semiconductor line structures in drying liquids with application to pattern collapse
Peter, Daniel, Dalmer, Michael, Lechner, Alfred, Gigler, Alexander M, Stark, Robert W, Bensch, WolfgangVolume:
21
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/21/2/025001
Date:
February, 2011
File:
PDF, 890 KB
english, 2011