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Erratum: “Sub-Micron-Accuracy Gold-to-Gold Interconnection Flip-Chip Bonding Approach for Electronics–Optics Heterogeneous Integration”
Bui, Tung Thanh, Suzuki, Motohiro, Kato, Fumiki, Nemoto, Shunsuke, Watanabe, Naoya, Aoyagi, MasahiroVolume:
52
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.7567/JJAP.52.069202
Date:
June, 2013
File:
PDF, 386 KB
english, 2013