Hermetic integration of liquids using high-speed stud bump...

Journal of Micromechanics and Microengineering 2012 / 04 Vol. 22; Iss. 4

Hermetic integration of liquids using high-speed stud bump bonding for cavity sealing at the wafer level

Antelius, Mikael, Fischer, Andreas C, Niklaus, Frank, Stemme, Göran, Roxhed, Niclas
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Volume:
22
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/22/4/045021
Date:
April, 2012
File:
PDF, 1.06 MB
english, 2012
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