Room-Temperature Cu Microjoining with Ultrasonic Bonding of...

Room-Temperature Cu Microjoining with Ultrasonic Bonding of Cone-Shaped Bump

Qiu, Lijing, Ikeda, Akihiro, Noda, Kazuhiro, Nakai, Seiya, Asano, Tanemasa
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Volume:
52
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.7567/JJAP.52.04CB10
Date:
April, 2013
File:
PDF, 112 KB
english, 2013
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