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Design, microfabrication and characterization of planarized multilayer atom chips with enhanced heat dissipation
Chuang, Ho-Chiao, Weng, Chung-Wen, Li, Hsiang-FuVolume:
21
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/21/12/125009
Date:
December, 2011
File:
PDF, 254 KB
english, 2011