Modeling and Validating the Transient Behavior of Flat Miniature Heat Pipes Manufactured in Multilayer Printed Circuit Board Technology
Wits, Wessel W., Kok, Jim B. W.Volume:
133
Year:
2011
Language:
english
Journal:
Journal of Heat Transfer
DOI:
10.1115/1.4003709
File:
PDF, 601 KB
english, 2011