Planarization properties of an alkaline slurry without an...

Planarization properties of an alkaline slurry without an inhibitor on copper patterned wafer CMP

Wang, Chenwei, Liu, Yuling, Tian, Jianying, Niu, Xinhuan, Zheng, Weiyan, Yue, Hongwei
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Volume:
33
Language:
english
Journal:
Journal of Semiconductors
DOI:
10.1088/1674-4926/33/11/116001
Date:
November, 2012
File:
PDF, 730 KB
english, 2012
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