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Planarization properties of an alkaline slurry without an inhibitor on copper patterned wafer CMP
Wang, Chenwei, Liu, Yuling, Tian, Jianying, Niu, Xinhuan, Zheng, Weiyan, Yue, HongweiVolume:
33
Language:
english
Journal:
Journal of Semiconductors
DOI:
10.1088/1674-4926/33/11/116001
Date:
November, 2012
File:
PDF, 730 KB
english, 2012