The Study on Deposition Process and Mechanical Properties of Deposited Cu Thin Films Using Molecular Dynamics
Huang, Jen Ching, Liao, Yi Chia, Liu, Huail Siang, Cheng, Fu JenVolume:
684
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.684.37
Date:
April, 2013
File:
PDF, 782 KB
english, 2013