MD simulations of near surface void in copper under thermal...

MRS Proceedings 2012 / 1 Vol. 1411

MD simulations of near surface void in copper under thermal compression

Pohjonen, Aarne S., Djurabekova, Flyura, Kuronen, Antti
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Volume:
1411
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/opl.2012.759
Date:
January, 2012
File:
PDF, 2.03 MB
english, 2012
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