Flipchip Bonding of Si Chip on Flexible PEN Foil using...

MRS Proceedings 2007 / 1 Vol. 1030

Flipchip Bonding of Si Chip on Flexible PEN Foil using Novel Electronic 100 μm Pitch Fan-out Circuitry

Brand, Jeroen van den, Veninga, Erik, Kusters, Roel, Podprocky, Tomas, Dietzel, Andreas
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Volume:
1030
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/PROC-1030-G05-10
Date:
January, 2007
File:
PDF, 381 KB
english, 2007
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