Via Diode in Cu Backend Process for 3D Cross-Point RRAM...

IEEE Journal of the Electron Devices Society 2014 / 11 Vol. 2; Iss. 6

Via Diode in Cu Backend Process for 3D Cross-Point RRAM Arrays

Liao, Yu-Cheng, Pan, Hsin-Wei, Hsieh, Min-Che, Chang, Tzong-Sheng, Chih, Yu-Der, Tsai, Ming-Jinn, Lin, Chrong Jung, King, Ya-Chin
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Volume:
2
Language:
english
Journal:
IEEE Journal of the Electron Devices Society
DOI:
10.1109/JEDS.2014.2339296
Date:
November, 2014
File:
PDF, 915 KB
english, 2014
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