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Optimized Process Sequences for Prototyping of Molded Interconnect Devices
Jürgenhake, Christoph, Fechtelpeter, Christian, Dumitrescu, Roman, Heidsiek, DanielVolume:
1038
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.1038.19
Date:
September, 2014
File:
PDF, 1.63 MB
english, 2014