Reliability of Cu to Cu Joints Fabricated Using SnAg Capping Layer for 3D TSV Applications
Ma, Sung Woo, Lee, Jeong Hwan, Lee, Jin Su, Kim, Ki Bum, Suh, Min Suk, Kim, Nam Seog, Kim, Young HoVolume:
900
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.900.711
Date:
February, 2014
File:
PDF, 1.27 MB
english, 2014