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Method of mould alignment for double-sided hot embossing of microfluidic devices using kinematic constraints
Song, In-Hyouk, Park, Taehyun, Conner, Timothy, You, Byoung HeeVolume:
9
Language:
english
Journal:
Micro & Nano Letters
DOI:
10.1049/mnl.2014.0134
Date:
October, 2014
File:
PDF, 414 KB
english, 2014