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Monolithic Thin Wafer Stacking Using Low Temperture Direct...

Monolithic Thin Wafer Stacking Using Low Temperture Direct Bonding

Burggraf, J., Bravin, J., Wiesbauer, H., Dragoi, V.
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Volume:
64
Language:
english
Journal:
ECS Transactions
DOI:
10.1149/06405.0095ecst
Date:
August, 2014
File:
PDF, 228 KB
english, 2014
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