Monolithic Thin Wafer Stacking Using Low Temperture Direct Bonding
Burggraf, J., Bravin, J., Wiesbauer, H., Dragoi, V.Volume:
64
Language:
english
Journal:
ECS Transactions
DOI:
10.1149/06405.0095ecst
Date:
August, 2014
File:
PDF, 228 KB
english, 2014