Effects of Suspending Abrasives on the Lubrication Properties of Slurry in Chemical Mechanical Polishing of Silicon Wafer
Liu, J.Y., Jin, Zhu Ji, Guo, Dong Ming, Kang, Ren KeVolume:
304-305
Year:
2006
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.304-305.359
File:
PDF, 315 KB
english, 2006