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[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Examining the required properties of build-up dielectric materials for next generation IC package substrates
Deguchi, Hidenobu, Hayashi, Tatsushi, Tanaka, Teruhisa, Tanaka, Toshiaki, Shirahase, KazutakaYear:
2015
Language:
english
DOI:
10.1109/ICEP-IAAC.2015.7111089
File:
PDF, 743 KB
english, 2015