32nm Node Highly Reliable Cu/Low-k Integration Technology...

MRS Proceedings 2011 / 1 Vol. 1335

32nm Node Highly Reliable Cu/Low-k Integration Technology with CuMn Alloy Seed

Yao, Shaoning, McGahay, Vincent, Angyal, Matthew S., Simon, Andrew H., Lee, Tom C., Christiansen, Cathryn, Li, Baozhen, Chen, Fen, McLaughlin, Paul S., Ogunsola, Oluwafemi O., Grunow, Stephan
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Volume:
1335
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/opl.2011.1261
Date:
January, 2011
File:
PDF, 296 KB
english, 2011
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