Advanced Cu Interconnection via Electroless-Plated Ni...

ECS Journal of Solid State Science and Technology 2014 / 08 Vol. 3; Iss. 10

Advanced Cu Interconnection via Electroless-Plated Ni Interlayer on the Gate of Oxide Thin-Film Transistors

Nam, S. H., Moon, T. H., Lee, K. W., Lee, K. H., Yoo, S. S., Shin, W. S., Yang, M. S., Im, S.
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Volume:
3
Language:
english
Journal:
ECS Journal of Solid State Science and Technology
DOI:
10.1149/2.00814410jss
Date:
August, 2014
File:
PDF, 1.43 MB
english, 2014
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