SPIE Proceedings [SPIE Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS 2002 - Cannes-Mandelieu, France (Tuesday 19 March 2002)] Design, Test, Integration, and Packaging of MEMS/MOEMS 2002 - Strength and long-term reliability testing of wafer-bonded MEMS
Petzold, Matthias, Katzer, Dieter, Wiemer, M., Bagdahn, Joerg, Courtois, Bernard, Karam, Jean Michel, Markus, Karen W., Michel, Bernd, Mukherjee, Tamal, Walker, James A.Volume:
4755
Year:
2002
Language:
english
DOI:
10.1117/12.462863
File:
PDF, 492 KB
english, 2002