Oblique Ion Etching for Copper at Elevated Temperature

Materials Science Forum 2010 / 12 Vol. 670

Oblique Ion Etching for Copper at Elevated Temperature

Hino, Tomoaki, Kobayashi, T., Yamauchi, Y., Nobuta, Y., Nishikawa, M.
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Volume:
670
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.670.131
Date:
December, 2010
File:
PDF, 604 KB
english, 2010
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