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[Integrated Circuits and Systems] Wafer Level 3-D ICs Process Technology || Direct Hybrid Bonding
Tan, Chuan Seng, Gutmann, Ronald J., Reif, L. RafaelVolume:
10.1007/97
Year:
2008
Language:
english
DOI:
10.1007/978-0-387-76534-1_11
File:
PDF, 738 KB
english, 2008