[ECS ISTC/CSTIC 2009 (CISTC) - Shanghai, China (March 19 - March 20, 2009)] ECS Transactions - Wafer Level SAW RF Filter Packaging With Through Wafer Via Interconnection
Kweon, Youngdo, Park, Seungwook, Kim, Taehoon, Honh, Jupyo, Yang, Sijoong, Ha, Job, Kim, Taeho, Yi, SungYear:
2009
Language:
english
DOI:
10.1149/1.3096534
File:
PDF, 295 KB
english, 2009