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High-Performance Temporary Adhesives for Wafer Bonding Applications
Puligadda, Rama, Pillalamarri, Sunil, Hong, Wenbin, Brubaker, Chad, Wimplinger, Markus, Pargfrieder, StefanVolume:
970
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/PROC-0970-Y04-09
Date:
January, 2006
File:
PDF, 831 KB
english, 2006