Experimental and Simulation Research on Influence of Temperature on Nano-Scratching Process of Silicon Wafer
Okabe, H., Tsumura, T., Shimizu, Jun, Zhou, Li Bo, Eda, HiroshiVolume:
329
Year:
2007
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.329.379
File:
PDF, 1.04 MB
english, 2007