Ablation Free Dicing of 4H-SiC Wafers with Feed Rates up to...

MRS Proceedings 2012 / 1 Vol. 1433

Ablation Free Dicing of 4H-SiC Wafers with Feed Rates up to 200 mm/s by Using Thermal Laser Separation

Lewke, Dirk, Koitzsch, Matthias, Schellenberger, Martin, Pfitzner, Lothar, Ryssel, Heiner, Zühlke, Hans-Ulrich
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Volume:
1433
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/opl.2012.1035
Date:
January, 2012
File:
PDF, 1.53 MB
english, 2012
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