[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Thermal conductivity of epoxy composites with controlled high loading of ceramic particles
Ying-Nan Chan,, Shu-Chen Huang,, Hsun-Tien Li,Year:
2015
Language:
english
DOI:
10.1109/ICEP-IAAC.2015.7111034
File:
PDF, 743 KB
english, 2015