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Thermal Cycling Induced Plastic Deformation in Solder Joints—Part I: Accumulated Deformation in Surface Mount Joints
Pan, Tsung-YuVolume:
113
Year:
1991
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2905373
File:
PDF, 1.10 MB
english, 1991