![](/img/cover-not-exists.png)
[ECS 214th ECS Meeting - Honolulu, HI (October 12 - October 17, 2008)] ECS Transactions - Electroplated Cu Micro Electrode for the Application in Micro Sinking Electro Discharge Machining (Micro-SEDM)
Gatzen, H. H., Klocke, Fritz, Kamenzky, Susanne, Traisigkhachol, OrnwasaYear:
2009
Language:
english
DOI:
10.1149/1.3140027
File:
PDF, 748 KB
english, 2009