Electrochemical Alloying of Copper Substrate with Tin Using...

Journal of The Electrochemical Society 2007 Vol. 154; Iss. 11

Electrochemical Alloying of Copper Substrate with Tin Using Ionic Liquid as an Electrolyte at Medium-Low Temperatures

Murase, Kuniaki, Kurosaki, Ryoichi, Katase, Takuma, Sugimura, Hiroyuki, Hirato, Tetsuji, Awakura, Yasuhiro
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Volume:
154
Year:
2007
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.2776230
File:
PDF, 549 KB
english, 2007
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