Influence of additives on Cu electrodeposition mechanisms in acid solution: direct current study supported by non-electrochemical measurements
L Bonou, M Eyraud, R Denoyel, Y MassianiVolume:
47
Year:
2002
Language:
english
Pages:
10
DOI:
10.1016/s0013-4686(02)00356-0
File:
PDF, 663 KB
english, 2002