Influence of additives on Cu electrodeposition mechanisms...

Influence of additives on Cu electrodeposition mechanisms in acid solution: direct current study supported by non-electrochemical measurements

L Bonou, M Eyraud, R Denoyel, Y Massiani
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Volume:
47
Year:
2002
Language:
english
Pages:
10
DOI:
10.1016/s0013-4686(02)00356-0
File:
PDF, 663 KB
english, 2002
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