Stress Corrosion Cracking of Cu Interconnects during CMP with a Cu/Porous Low-k Structure
Kodera, Masako, Uekusa, Shin-ichiro, Nagano, Hidekazu, Tokushige, Katsuhiko, Shima, Shohei, Fukunaga, Akira, Mochizuki, Yoshihiro, Fukuda, Akira, Hiyama, Hiroyuki, Tsujimura, Manabu, Nagai, Hirokuni,Volume:
152
Year:
2005
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.1905970
File:
PDF, 780 KB
english, 2005