[IEEE 2014 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - Millbrae, CA, USA (2014.10.6-2014.10.9)] 2014 SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - Prototype of multi-stacked memory wafers using low-temperature oxide bonding and ultra-fine-dimension copper through-silicon via interconnects

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