![](/img/cover-not-exists.png)
[IEEE 2014 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - Millbrae, CA, USA (2014.10.6-2014.10.9)] 2014 SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - Prototype of multi-stacked memory wafers using low-temperature oxide bonding and ultra-fine-dimension copper through-silicon via interconnects
Lin, Wei, Faltermeier, Johnathan, Winstel, Kevin, Skordas, Spyridon, Graves-Abe, Troy, Batra, Pooja, Herman, Kenneth, Golz, John, Kirihata, Toshiaki, Garant, John, Hubbard, Alex, Cauffman, Kris, LevinYear:
2014
Language:
english
DOI:
10.1109/S3S.2014.7028246
File:
PDF, 1.61 MB
english, 2014