Exploiting Die-to-Die Thermal Coupling in 3-D IC Placement

IEEE Transactions on Very Large Scale Integration (VLSI) Systems 2014 / 10 Vol. 22; Iss. 10

Exploiting Die-to-Die Thermal Coupling in 3-D IC Placement

Athikulwongse, Krit, Ekpanyapong, Mongkol, Lim, Sung Kyu
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Volume:
22
Language:
english
Journal:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
DOI:
10.1109/TVLSI.2013.2285593
Date:
October, 2014
File:
PDF, 2.46 MB
english, 2014
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