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[Conference Proceedings of the Society for Experimental Mechanics Series] MEMS and Nanotechnology, Volume 5 || Warpage Measurement of Simulated Electronic Packaging Assembly

Shaw III, Gordon, Prorok, Barton C., Starman, LaVern, Furlong, Cosme
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Volume:
10.1007/97
Year:
2014
Language:
english
DOI:
10.1007/978-3-319-00780-9_1
File:
PDF, 847 KB
english, 2014
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