[Conference Proceedings of the Society for Experimental Mechanics Series] MEMS and Nanotechnology, Volume 5 || Warpage Measurement of Simulated Electronic Packaging Assembly
Shaw III, Gordon, Prorok, Barton C., Starman, LaVern, Furlong, CosmeVolume:
10.1007/97
Year:
2014
Language:
english
DOI:
10.1007/978-3-319-00780-9_1
File:
PDF, 847 KB
english, 2014