Effect of Continuous Casting Parameters on Microstructure...

Advanced Materials Research 2007 Vol. 26-28

Effect of Continuous Casting Parameters on Microstructure and Texture of Gold Bonding Wire for Semiconductor Packaging

Kim, Won Yong, Kim, Han Sol, Chung, Eun Kyun
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Volume:
26-28
Year:
2007
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.26-28.589
File:
PDF, 958 KB
english, 2007
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