Chemical Mechanical Planarization of Tungsten with Hard...

Electrochemical and Solid-State Letters 2010 Vol. 13; Iss. 6

Chemical Mechanical Planarization of Tungsten with Hard Abrasives

Wang, Jun, Cherian, Isaac K., Haerle, Andrew G.
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Volume:
13
Year:
2010
Language:
english
Journal:
Electrochemical and Solid-State Letters
DOI:
10.1149/1.3358135
File:
PDF, 156 KB
english, 2010
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