The Risk of Pattern Collapse for Structures in Future Logic Devices
Sankarapandian, M., Peethala, B., Canaperi, D., Peter, Daniel, Engesser, Philipp, Okorn-Schmidt, HaraldVolume:
195
Language:
english
Journal:
Solid State Phenomena
DOI:
10.4028/www.scientific.net/SSP.195.107
Date:
December, 2012
File:
PDF, 901 KB
english, 2012