Improving Releasability of Mold Materials for IC Encapsulation Using Epoxy Compounds
Kitaoka, Satoshi, Kawashima, Naoki, Yoshiya, Masato, Miyagawa, Shigeru, Noguchi, Yoshinori, Ikemura, KazuhiroVolume:
706-709
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.706-709.2529
Date:
January, 2012
File:
PDF, 612 KB
english, 2012